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Teledyne Receives Trusted Accreditation Award

THOUSAND OAKS, Calif. – April 9, 2008 – Teledyne Technologies Incorporated (NYSE: TDY) announced today that its Teledyne Microelectronic Technologies business unit, has received Trusted Accreditation by the Defense Microelectronics Activity (DMEA) as a Microelectronics Trusted Source for the Department of Defense (DoD) and all other U.S. Government customers.

This important Trusted Accreditation award includes Microelectronics Packaging, Assembly and Test services. Teledyne has served the DoD, U.S. Government agencies and major prime contractors in providing state-of-the-art microelectronics packaging services with military and aerospace reliability. Teledyne is one of only two companies offering Trusted Microelectronics Packaging, Assembly and Test services.

“Teledyne Microelectronic Technologies has consistently delivered high integrity, secure communications products to U.S. Government customers and agencies from our secure facility,” said Robert Mehrabian, chairman, president and chief executive officer of Teledyne Technologies Incorporated. “We are honored to be one of the first companies awarded this Trust Accreditation, as the DoD is advancing a broad strategy to address the growing offshore migration of semiconductor fabrication plants and electronics assembly operations.”

Teledyne Technologies is a leading provider of sophisticated electronic subsystems, instrumentation and communication products, engineered systems, aerospace engines, and energy and power generation systems. Teledyne Technologies’ operations are primarily located in the United States, the United Kingdom, and Mexico. For more information, visit Teledyne Technologies’ website at www.teledyne.com.

Investor Contact: Jason VanWees (805) 373-4542

Press Contact: Robyn McGowan (805) 373-4540

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